Canon, the Japanese firm best known for its printers and cameras, launched a critical tool on Friday it says can help manufacture the most advanced semiconductors around.

“Nanoimprint lithography” is Canon’s latest challenge to Dutch firm ASML, which dominates the extreme ultraviolet (EUV) lithography market. TSMC, the Taiwanese manufacturer of iPhones, uses ASML’s tools to manufacture the most advanced chips for the iPhone.

The U.S. and China have been battling over technology with these machines.

Due to its ability to manufacture semiconductors at 5 nanometers and below, ASML’s EUV technology has become increasingly popular among the most advanced chipmakers. Nanometers refer to the size of the features on a chip. The smaller that figure, the more features can fit onto a chip, thus increasing its power.

A new Canon machine, called the FPA-1200NZ2C, will be able to produce semiconductors as small as 2nm and equivalent to a 5nm process. In context, Apple’s iPhone 15 Pro and Pro Max contain a 3nm A17 Pro chip.

It is expected that TSMC and Samsung, two of the world’s largest advanced chip manufacturers, will make 2nm chips by 2025.

In order to effectively print a chip’s design onto the semiconductor material, lithography machines are essential.

Ultraviolet light is used during this process by ASML’s machines. In order to reduce power consumption, Canon said its machine does not require a light source with a specific wavelength.